In this age of the increasing IoT (Internet of Things), microcircuits are in everything! From your TV, to your phone, to car, to smart watch, to electronic keypad hooked into your home alarm system, to ... well, you get the picture.
And yet for the majority of electronics users, aside from the occasional and often unintentional peek (such as when I accidentally dropped my portable car phone in the 1980's revealing the electronic guts inside) at a printed circuit board assembly (PCBA), electronics manufacturing and all those different sized dots and boxes, etc. stuck somehow onto a green circuit board remain a mystery.
I have had more than a few occasions the opportunity to examine the internal configurations of varying types of integrated circuits. In high-reliability applications, it is not uncommon to perform analytical testing (destructive and nondestructive) as a means of quality control and counterfeit avoidance. I wish that more consumers could take a look at the internal configuration of an IC such as the De-Capped PGA shown to the left. Internal examination of the die cavity reveals the intricate beauty of die and wire bond - which must be viewed under great magnification to appreciate. It is a thing of beauty.
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I read interesting article from Advanced Assembly (@smtassembly) entitled "IC Packages: Not Just for the Holidays" explaining the basics of IC assembly and packaging. I think it is a helpful introduction to anyone looking for a general understanding of electronics assembly as well as the impact package selection has on performance and operation of an IC. The article also includes a link for a FREE Component Sizing Chart.
"Packages for IC’s have been instrumental in creating devices that can withstand the rigors of daily use. In addition to this protection, the packaging can increase design flexibility in how they are integrated into the final product, as well as can change the electrical characteristics of the IC, whether for better or for worse. The correct or incorrect selection of the package types can mean success or failure of a project."
I have now been providing engineering and manufacturing, test and analytical services, and quality systems management services for over 20 years. That background of experience provides a solid foundation of understanding for the complexities of product design and manufacturing throughout all stages of the product life cycle, and is the framework for our offer as a single point of contact for a wide variety of test and build-to-print manufacturing services. Please contact me if I can be of any assistance.
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